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Dima BTU Model SMRO 0402 Zepher Reflow Oven

Used / Second Hand

Refurbished Price [?]
£ Login or Register for price
Availability:
In stock now
Stock No
OW1660
Model
SMRO 0402 Zepher
Serial
954011
New or Used
Used (Second Hand)
Internal Size (WxDxH mm)
400 x 1650 x 30
Max Temp
300°C
Other Info
Inert gas oxide free soldering facility
Location
Our Central Warehouse, Aldridge, UK
Weight (kgs)
150
External Dimensions (WxDxH mm)
1700 x 910 x 1180

Description

The solution for demanding lead free soldering of small to medium series on mesh belt conveyor!

The Zepher is an oven with a stainless mesh belt conveyor. The mesh belt is ideal for constant changing dimensions or a mix of circuit boards

The combination of several individual adjustable heating zones together with the variable transportation speed enables the user to attain a wide variety of thermal profiles, easy to reproduce when saved.

DIMA offers the ideal solution for lead or lead free soldering of printed circuit board and other electronic assemblies.

The oven can also be used to cure SMD glue.

Features

  • Lead free tested
  • 8 independently controlled heating zones
  • Integrated cooling zone  
  • Integrated reflow profiler
  • Microprocessor control for 99 different programs
  • Mesh belt conveyor 
  • Integrated exhaust system
  • Air ioniser for ESD safe reflow soldering

DIMA’s Zepher offers a powerful radiated heating irrespective of the size and mass of the components. The unlimited variations of temperature profiles is achieved by the tunnel design.

To minimise the stress for double sided boards the top and bottom temperature can be set independently.

The system’s memory stores up to 99 different profiles. The RS232 port allows PC interface for entry and storage of additional programs as well as remote control of operating procedure, QC monitoring, and generation of hard copies as needed.

Other features include an integral exhaust system that removes solder fumes while cooling the system exterior. Air Ionised controls static The system is also designed to accommodate an inert gas purge. To eliminated the possibility of damage caused by static, the Zepher includes an air ioniser in the cool down zone as standard equipment.

Hot Air By circulating hot air over a surface of a particular temperature the surface and the inner of that surface will heat up depending on the temperature of the air circulated. Hot air will heat up the surface until it reaches the temperature of the hot air. The surface temperature will never exceed the temperature of the air. A high volume of air moved around will transfer the heat quicker than a low volume of air.

The oven is designed in a way that the air circulates within a zone. Because the zones are not completely separated, two neighboring zones may influence each other. Other features include an integral exhaust system that removes solder fumes while cooling the system exterior

Temperature control

A dedicated TFT touchscreen permits continuous monitoring of the production run. Two external thermocouple connection for mounting on the board provide real time profiling, shown in convenient graph format and board temperatures through each zone shown in real time.

In an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum. These full convection reflow ovens with topside circulating hot air achieve perfect heating profiles despite their modest size

Up to 100 programs can be stored The system’s memory stores up to 100 different programs and max. 99 different profiles. The USB port allows PC interface for entry and storage of additional programs as well as remote control of operating procedure, QC monitoring, and generation of hard copies as needed with the optional Oven Management software.

Lead free approved Leading solder paste manufacturers have approved this oven for lead free soldering without any limitations. Naturally these reflow overns are designed to be compatible with all today’s lead free solders. Stainless steel mesh belt (RO-403) Air ionised controls static To eliminate the possibility of damage caused by static, the Breeze includes an air ioniser in the cool down zone as standard equipment.

Zepher SMRO-0402 Type Reflow Oven Reflow Oven

  • Dimension (L x W x H) 1700 x 910 x 1180 mm
  • Conveyor 400 mm wide stainless steel mesh belt 390 mm wide chain with 5 mm pins 
  • Product dimension Max. 400 mm width,
  • Transport speed 50 - 800 Mm/min
  • Max board size 4oo wide x 30 mm high
  • Nitrogen atmosphere injection into process chamber
  • RS232 Comms interface
  • Controller Microprocessor controller for heating and cooling zones,
  • with USB port (for optional Oven Manager Sofware)
  • Speed and temperature profiling controlled via TFT touchscreen or by optional PC
  • Heating System Hot air combined with long wave infrared radiation 
  • 8 heating zones, 1 cool down zone
  • Profiling 2 external thermocouples included.
  • Exhaust Two integrated exhaust ventilators with total airflow of 150 m³/h
  • If the exhaust pipe is longer than 4 m, an additional exhaust ventilator is needed.
  • Cooling Axial ventilator with integrated ionising for ESD safe soldering
  • Heating power 6300 Watt
  • Software included Evaluation Oven Manager software
  • User Interface Standard interface via TFT-display with touchscreen on the oven
  • Tunnel length 950 mm
  • Power requirements 3 phase 380 / 415 V with neutral,
  • optional: 3 phase 220 / 240 V without neutral
  • 32 Amp 8.7Kw, during operation +/- 3 Kw/h
  • Weight 190 Kg 195 Kg

 

 

pdf icon Print / Download Dima BTU Model SMRO 0402 Zepher Reflow Oven Datasheet

Additional files

Photographs taken prior refurbishment. Our refurbishment service is not available on all machines.